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VND5N07-1-E - STMicroelectronics

Description: OMNIFET II fully autoprotected Power MOSFET ,ILIMH:5 A ,RDS (on):0.2Ω ,VCLAMP:70V .

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VND5N07-1-E - STMicroelectronics PCB footprint - Other - Other - IPAK-2026-7.0
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VND5N07-1-E - STMicroelectronics  - 3D model - Other - IPAK-2026-7.0
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VND5N07-1-E Details

  • Manufacturer Part Number:

    VND5N07-1-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-251

  • Package Description:

    ROHS COMPLIANT, TO-251, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PSIP-T3

  • Length:

    6.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    7.4 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.25 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    5 µs

  • Turn-on Time:

    0.25 µs

  • Width:

    2.3 mm

VND5N07-1-E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the VND5N07-1-E is -40°C to 150°C.
  • To ensure reliability, it's recommended to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power handling capabilities at high temperatures.
  • A recommended PCB layout should include a solid ground plane, wide traces for power and ground, and a thermal pad connected to a heat sink or thermal vias. A thermal management strategy should include a heat sink, thermal interface material, and a cooling system.
  • To protect the VND5N07-1-E from ESD, handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper handling and storage procedures.
  • The recommended soldering conditions for the VND5N07-1-E are a peak temperature of 260°C, a soldering time of 10 seconds, and a soldering method that follows the IPC J-STD-020 standard.

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VND5N07-1-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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