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VND5T035LAK-E - STMicroelectronics

Description: Power Switch/Driver 1:1 N-Channel 30A PowerSSO-24™ On/Off 4V ~ 36V 35mOhm Surface Mount -40°C ~ 150°C (TJ)

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VND5T035LAK-E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO-24_2025
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VND5T035LAK-E Details

  • Manufacturer Part Number:

    VND5T035LAK-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PowerSSO-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE; TRANSIENT

  • Driver Number of Bits:

    2

  • Input Characteristics:

    GATED

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    10.3 mm

  • Number of Functions:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-SOURCE

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP24,.4,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.47 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    54 µs

  • Turn-on Time:

    46 µs

  • Width:

    7.5 mm

VND5T035LAK-E Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4841, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • Follow the recommended soldering and reflow profile guidelines provided in the STMicroelectronics soldering guide, which includes temperature and time profiles to ensure reliable assembly and minimize defects.
  • The VND5T035LAK-E has a thermal pad that must be connected to a thermal ground plane or heat sink to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve thermal conductivity. Additionally, ensure good airflow and avoid blocking airflow around the device.
  • Use a systematic approach to troubleshoot issues, starting with checking the power supply, signal integrity, and PCB layout. Consult the datasheet and application notes for guidance on troubleshooting common issues. If issues persist, contact STMicroelectronics support for further assistance.
  • Yes, the VND5T035LAK-E is sensitive to electrostatic discharge (ESD). Handle the device with ESD-protective equipment, and ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, to prevent damage during assembly and operation.

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VND5T035LAK-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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