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VND830SPTR-E - STMicroelectronics

Description: DOUBLE CHANNEL HIGH SIDE DRIVER

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VND830SPTR-E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSO-10_1_2022
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VND830SPTR-E Details

  • Manufacturer Part Number:

    VND830SPTR-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-10

  • Pin Count:

    10

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    9.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP10,.55

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    3.75 mm

  • Supply Current-Max:

    14 mA

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

VND830SPTR-E Frequently Asked Questions (FAQs)

  • A good PCB layout for the VND830SPTR-E involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The VND830SPTR-E requires a stable power supply with a voltage range of 3.3V to 5V. A decoupling capacitor of 100nF to 1uF should be placed close to the device, and a larger capacitor (10uF to 100uF) should be placed near the power supply. Additionally, a 10kΩ to 100kΩ pull-up resistor should be used on the enable pin.
  • The maximum current rating of the VND830SPTR-E is 1.5A per channel, with a total current rating of 3A for both channels. However, the actual current rating may vary depending on the application and operating conditions.
  • The VND830SPTR-E has built-in overvoltage protection (OVP) and overcurrent protection (OCP). However, additional protection can be achieved by using external components such as TVS diodes, zener diodes, or fuses. It is also recommended to use a voltage regulator to regulate the input voltage.
  • The VND830SPTR-E has a thermal pad that should be connected to a solid ground plane to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB. Additionally, a heat sink or a thermal shield can be used to further improve thermal management.

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VND830SPTR-E Overview

Use the download button to access the VND830SPTR-E schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like VND83, or try a keyword search, such as Peripheral Drivers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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