TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits:
4
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G10
JESD-609 Code:
e3
Length:
9.4 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
10
Output Current Flow Direction:
SINK
Output Current-Max:
6 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP10,.55FL
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
250
Qualification Status:
Not Qualified
Seated Height-Max:
3.75 mm
Supply Voltage-Max:
36 V
Supply Voltage-Min:
6 V
Supply Voltage-Nom:
13 V
Surface Mount:
YES
Technology:
MOS
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Turn-off Time:
140 µs
Turn-on Time:
70 µs
Width:
7.5 mm
VNQ660SP Frequently Asked Questions (FAQs)
The VNQ660SP can operate from -40°C to 150°C, making it suitable for high-temperature applications.
To ensure EMC, follow proper PCB design guidelines, use a shielded cable, and consider adding a common-mode choke or ferrite bead to the output stage.
Keep the input and output stages separate, use a star-ground configuration, and minimize track lengths to reduce EMI and noise.
Yes, the VNQ660SP can handle high-voltage applications up to 560V, but ensure proper insulation and creepage distances to prevent electrical shock.
Use an oscilloscope to check the input and output waveforms, verify the power supply voltage, and check for overheating or electrical overstress.
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VNQ660SP Overview
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About STMicroelectronics
STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components.
STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut
