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VNQ830PEP-E - STMicroelectronics

Description: Quad channel high side driver

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VNQ830PEP-E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO-24 package
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VNQ830PEP-E Details

  • Manufacturer Part Number:

    VNQ830PEP-E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, POWER, SSO-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    4

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Terminals:

    24

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    18 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SOP24,.4,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.22 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

VNQ830PEP-E Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
  • Implement a thermal management strategy, such as heat sinks or fans, and ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • A 10uF to 22uF ceramic capacitor is recommended for input decoupling, placed as close to the device as possible to minimize noise and ensure stable operation.
  • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits, such as a voltage supervisor and a current sense resistor, to prevent damage from voltage and current surges.
  • Use a compact layout, minimize trace lengths, and keep sensitive analog signals away from digital signals. Also, use a ground plane and shielded cables to reduce EMI radiation.

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VNQ830PEP-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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