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VS-1EQH01HM3/H - Vishay

Description: Rectifiers 100V 1A Fred Pt MicroSMP (DO-219AD)

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PCB Footprints
VS-1EQH01HM3/H - Vishay PCB footprint - Other - Other - VS-1EQH01HM3/H-4
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3D Models
VS-1EQH01HM3/H - Vishay  - 3D model - Other - VS-1EQH01HM3/H-4
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VS-1EQH01HM3/H Details

  • Manufacturer Part Number:

    VS-1EQH01HM3/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    5 Weeks

  • Date Of Intro:

    2019-04-03

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.07

  • Additional Feature:

    FREE WHEELING DIODE, SNUBBER DIODE, LOW POWER LOSS, LOW LEAKAGE CURRENT

  • Application:

    ULTRA FAST RECOVERY

  • Breakdown Voltage-Min:

    100 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.97 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    0.023 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

VS-1EQH01HM3/H Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the device, with multiple vias to the bottom layer to dissipate heat effectively. Additionally, keeping the PCB traces and components away from the device's thermal path can help reduce thermal resistance.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the device, and avoid applying excessive force or pressure during the soldering process.
  • The maximum allowed voltage derating for the VS-1EQH01HM3/H is typically 80% of the maximum rated voltage, which is 100V in this case. This means the device can be safely operated up to 80V without compromising its reliability or performance.
  • While the VS-1EQH01HM3/H is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with some limitations. However, the device's performance may degrade at higher frequencies due to increased switching losses and parasitic inductance. It's essential to evaluate the device's performance in your specific application and consider alternative devices if necessary.
  • To protect the device from overvoltage and overcurrent conditions, consider adding overvoltage protection (OVP) and overcurrent protection (OCP) circuits in your design. These circuits can be implemented using external components such as zener diodes, TVS diodes, and current-sensing resistors. Additionally, ensure that the device is operated within its recommended operating conditions and follow proper PCB design and layout guidelines.

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VS-1EQH01HM3/H Overview

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