HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-3
ECCN Code:
EAR99
Manufacturer:
Vishay Intertechnologies
YTEOL:
0
Additional Feature:
FREE WHEELING DIODE
Application:
GENERAL PURPOSE
Case Connection:
CATHODE
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.98 V
JEDEC-95 Code:
TO-220AB
JESD-30 Code:
R-PSFM-T3
Non-rep Pk Forward Current-Max:
850 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Reference Standard:
AEC-Q101
Rep Pk Reverse Voltage-Max:
100 V
Reverse Current-Max:
1000 µA
Surface Mount:
NO
Technology:
SCHOTTKY
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
VS-43CTQ100HN3 Frequently Asked Questions (FAQs)
The recommended PCB footprint for the VS-43CTQ100HN3 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 1.5 mm x 0.5 mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) thermal pad.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air gun to solder the component. Avoid using excessive solder or flux, as it can cause bridging or shorts.
The maximum allowed voltage derating for the VS-43CTQ100HN3 is 80% of the maximum rated voltage. For example, if the maximum rated voltage is 100 V, the maximum allowed voltage derating would be 80 V.
To handle thermal management, ensure good thermal conductivity between the component and the PCB by using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Also, provide adequate airflow around the component, and consider using a heat sink or a thermal pad to dissipate heat.
Store the VS-43CTQ100HN3 in a dry, cool place, away from direct sunlight and moisture. Handle the component by the body, avoiding touching the leads or the thermal pad. Use anti-static packaging and handling materials to prevent electrostatic discharge (ESD) damage.
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VS-43CTQ100HN3 Overview
Use the download button to access the VS-43CTQ100HN3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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