The recommended PCB footprint for the VS-50TPS12LHM3 is a rectangular pad with dimensions of 12.7 mm x 7.62 mm (0.5 in x 0.3 in) with a 1.27 mm (0.05 in) spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C (482°F to 500°F) and a solder with a melting point of 180°C to 220°C (356°F to 428°F). Apply a small amount of solder to the pad and component lead, and use a soldering flux to reduce oxidation.
The maximum operating temperature range for the VS-50TPS12LHM3 is -40°C to 150°C (-40°F to 302°F), with a derating of 1.33% per °C above 125°C (257°F).
Yes, the VS-50TPS12LHM3 is suitable for high-reliability and aerospace applications, as it meets the requirements of MIL-PRF-19500 and is qualified to MIL-PRF-19500/556. However, it's essential to consult with Vishay Intertechnologies or a qualified distributor for specific requirements and certifications.
Handle the VS-50TPS12LHM3 by the body, avoiding touching the leads or glass passivation. Store the devices in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and use anti-static precautions to prevent ESD damage.
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VS-50TPS12LHM3 Overview
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