The recommended PCB footprint for the VS-85EPF12 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pads. Avoid applying excessive heat or pressure, which can damage the component.
The maximum operating temperature range for the VS-85EPF12 is -40°C to 150°C, with a derating of 1.33 mW/°C above 25°C.
Yes, the VS-85EPF12 is suitable for high-reliability and aerospace applications, as it meets the requirements of MIL-PRF-19500 and is qualified to NASA's EEE-INST-002 guidelines.
Handle the VS-85EPF12 by the body, avoiding touching the leads or glass body. Store the components in a dry, cool place, away from direct sunlight and moisture, and in their original packaging or anti-static bags.
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VS-85EPF12 Overview
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