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VS-8ETH03-M3 - Vishay

Description: VISHAY - VS-8ETH03-M3 - Fast / Ultrafast Diode, 300 V, 8 A, Single, 1.25 V, 35 ns, 100 A

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PCB Footprints
VS-8ETH03-M3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AC 2L_2022
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3D Models
VS-8ETH03-M3 - Vishay  - 3D model - Transistor Outline, Vertical - TO-220AC 2L_2022
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VS-8ETH03-M3 Details

  • Manufacturer Part Number:

    VS-8ETH03-M3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2018-01-29

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.37

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE

  • Application:

    HYPER FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Current-Max:

    20 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

VS-8ETH03-M3 Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the component away from high-current paths and heat sources. A thermal pad on the bottom of the device helps with heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Additionally, a heat sink or thermal interface material can be used to further improve thermal management.
  • To ensure reliable soldering, follow the recommended soldering profile (e.g., 260°C peak temperature, 3°C/s ramp rate). Use a solder with a melting point above 217°C. Avoid applying excessive force or pressure during assembly, and handle the component by the edges to prevent damage to the pins or package.
  • Operating the VS-8ETH03-M3 beyond the recommended temperature range (-40°C to 150°C) can lead to reduced performance, decreased lifespan, and potential failure. The device may experience increased thermal resistance, reduced current handling, and increased power dissipation, which can cause overheating and damage.
  • To troubleshoot issues, start by verifying the device's pinout and connections. Check for proper voltage supply, correct polarity, and adequate heat sinking. Use a multimeter to measure voltage drops, current consumption, and resistance. Analyze the device's thermal performance using thermal imaging or temperature measurement tools. Consult the datasheet and application notes for guidance on specific troubleshooting procedures.
  • Yes, the VS-8ETH03-M3 is sensitive to electrostatic discharge (ESD). Handle the device in an ESD-protected environment, wearing an ESD strap or wristband. Use ESD-safe packaging and storage materials. Avoid touching the device's pins or leads, and use a grounded tip when probing or measuring the device.

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VS-8ETH03-M3 Overview

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