The recommended PCB footprint for the VS-8EWL06FNTR-M3 is a rectangular pad with a size of 1.6 mm x 0.8 mm, with a 0.3 mm radius corner and a 0.2 mm spacing between pads.
To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal pad or a thermal interface material. Also, consider using a heat sink or a thermal management system to dissipate heat generated by the device.
The maximum operating temperature range for the VS-8EWL06FNTR-M3 is -55°C to 150°C, with a storage temperature range of -55°C to 180°C.
To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid exposing the device to mechanical stress, moisture, or extreme temperatures. Also, consider using a conformal coating to protect the device from environmental factors.
The recommended soldering profile for the VS-8EWL06FNTR-M3 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
VS-8EWL06FNTR-M3 Overview
Use the download button to access the VS-8EWL06FNTR-M3 schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like VS-8E,
or try a keyword search, such as Rectifier Diodes
