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VS-HFA25PB60-N3 - Vishay

Description: Vishay VS-HFA25PB60-N3, Switching Diode, 600V 25A, 75ns, 2-Pin TO-247AC

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Symbol
VS-HFA25PB60-N3 - Vishay - PCB symbol
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PCB Footprints
VS-HFA25PB60-N3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-50MILS
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3D Models
VS-HFA25PB60-N3 - Vishay - 3D model - Transistor Outline, Vertical - TO-247-50MILS
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VS-HFA25PB60-N3 Details

  • Manufacturer Part Number:

    VS-HFA25PB60-N3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    LOW NOISE, PD-CASE

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2 V

  • JEDEC-95 Code:

    TO-247AC

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    225 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    151 W

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    20 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

VS-HFA25PB60-N3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VS-HFA25PB60-N3 is a pad size of 1.5 mm x 1.5 mm with a 0.5 mm spacing between pads. However, it's recommended to consult the datasheet and application notes for specific guidance on PCB layout and thermal management.
  • To ensure reliable soldering of the VS-HFA25PB60-N3, use a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the pads and use a reflow oven or a hot air gun to solder the component.
  • The maximum operating temperature range for the VS-HFA25PB60-N3 is -55°C to 175°C. However, the device can withstand short-term excursions up to 200°C during soldering or other manufacturing processes.
  • Handle the VS-HFA25PB60-N3 by the body, avoiding touching the leads or electrical contacts. Store the devices in their original packaging or in a dry, ESD-protected environment to prevent moisture and electrostatic damage.
  • The VS-HFA25PB60-N3 has an ESD rating of Human Body Model (HBM) of ±2 kV and Charged Device Model (CDM) of ±500 V. Handle the devices with ESD-protected equipment and follow proper ESD handling procedures to prevent damage.

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VS-HFA25PB60-N3 Overview

Use the download button to access the VS-HFA25PB60-N3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like VS-HF, or try a keyword search, such as Rectifier Diodes

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