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VS-MBR745-M3 - Vishay

Description: Schottky Diodes & Rectifiers 45V 7.5A IF Single TO-220AC

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VS-MBR745-M3 - Vishay - PCB symbol
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PCB Footprints
VS-MBR745-M3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AC-2
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3D Models
VS-MBR745-M3 - Vishay - 3D model - Transistor Outline, Vertical - TO-220AC-2
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VS-MBR745-M3 Details

  • Manufacturer Part Number:

    VS-MBR745-M3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    11 Weeks

  • Date Of Intro:

    2018-01-29

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.22

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.84 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    7.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    100 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

VS-MBR745-M3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VS-MBR745-M3 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • While the VS-MBR745-M3 has a maximum operating temperature of 150°C, it's essential to consider the derating of the device's characteristics at high temperatures. Consult the datasheet and application notes for specific guidance on high-temperature operation.
  • To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid mechanical stress. Additionally, consider using a moisture-sensitive device (MSD) handling procedure and a bake-out process before assembly.
  • The recommended soldering profile for the VS-MBR745-M3 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Consult the datasheet and application notes for specific guidance on soldering profiles.
  • While the VS-MBR745-M3 is designed to withstand some vibration, it's essential to consider the specific vibration requirements of your application. Consult the datasheet and application notes for guidance on vibration testing and ensure that the device is properly secured to the PCB.

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VS-MBR745-M3 Overview

Use the download button to access the VS-MBR745-M3 schematic symbol, PCB footprint, and 3D model.
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VS-MBR745-M3 Alternates

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Part Image PBYR745 YAGEO Corporation

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For a full list of alternate parts for VS-MBR745-M3, check out Findchips.com