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VSC8574XKS-02 - Microchip

Description: Quad-Port 10/100/1000BASE-T PHY with Synchronous Ethernet, IEEE 1588, and QSGMII/SGMII MAC

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VSC8574XKS-02 - Microchip - PCB symbol
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VSC8574XKS-02 - Microchip PCB footprint - BGA - BGA - 256 - BGA
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VSC8574XKS-02 - Microchip - 3D model - BGA - 256 - BGA
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VSC8574XKS-02 Details

  • Manufacturer Part Number:

    VSC8574XKS-02

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    256

  • Manufacturer Package Code:

    PBGA-256

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Data Rate:

    1000000 Mbps

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    256

  • Number of Transceivers:

    4

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.8 mm

  • Supply Current-Max:

    980 mA

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

VSC8574XKS-02 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes. Use a common mode filter or a ferrite bead to reduce EMI.
  • Use a thermal management strategy such as heat sinks, thermal vias, or thermal pads to keep the junction temperature below 125°C. Ensure good airflow and avoid blocking airflow around the device.
  • Use a low-ESR capacitor (e.g., 10uF) close to the device's power pins. Ensure a clean and stable power supply with minimal noise and ripple. Use a voltage regulator or a power management IC to regulate the voltage.
  • Use a logic analyzer or an oscilloscope to monitor the device's signals. Check the device's configuration and programming. Verify the power supply and clock signals. Consult the datasheet and application notes for troubleshooting guides.
  • Use a shielded enclosure or a metal can to reduce EMI. Implement EMI filters or common mode chokes on the I/O lines. Ensure good grounding and use a low-pass filter on the power supply lines.

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VSC8574XKS-02 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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