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VSC8582XKS-14 - Microchip

Description: VSC8582-11 Dual-Port 10/100/1000BASE-T PHY with Synchronous Ethernet, VeriTime™, Intellisec™, and QSGMII/SGMII MAC.

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VSC8582XKS-14 - Microchip - PCB symbol
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PCB Footprints
VSC8582XKS-14 - Microchip PCB footprint - BGA - BGA - 256 - BGA
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3D Models
VSC8582XKS-14 - Microchip - 3D model - BGA - 256 - BGA
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VSC8582XKS-14 Details

  • Manufacturer Part Number:

    VSC8582XKS-14

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    256

  • Manufacturer Package Code:

    PBGA-256

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Data Rate:

    1000000 Mbps

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    17 mm

  • Number of Functions:

    1

  • Number of Terminals:

    256

  • Number of Transceivers:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    1.8 mm

  • Supply Current-Max:

    1130 mA

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

VSC8582XKS-14 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
  • Use a thermal management strategy such as heat sinks, thermal vias, or thermal pads to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended voltage and current ranges.
  • Power up the device in the following sequence: VCC, then AVCC, and finally the input signals. Ensure that the reset signal is asserted for at least 10ms to ensure a clean reset.
  • Use the power-down mode, disable unused features, and reduce the clock frequency to minimize power consumption. Also, consider using a low-power oscillator or an external clock source.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure that the PCB layout is optimized for EMI reduction. Also, consider using EMI filters or shielding on the input/output lines.

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VSC8582XKS-14 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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