A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power dissipation at high temperatures.
A soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux.
Handle the device by the body or the pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure that the workstation is ESD-protected. Store the device in an anti-static bag or tube.
Store the device in a dry, cool place, away from direct sunlight. The storage temperature should be between -40°C and 30°C, and the relative humidity should be below 60%.
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VSOP98260 Overview
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