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VTVS3V3ASMF-M3-08 - Vishay

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VTVS3V3ASMF-M3-08 Details

  • Manufacturer Part Number:

    VTVS3V3ASMF-M3-08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2019-11-06

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW NOISE

  • Breakdown Voltage-Max:

    7 V

  • Breakdown Voltage-Min:

    6.4 V

  • Breakdown Voltage-Nom:

    6.7 V

  • Clamping Voltage-Max:

    8.9 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-219AB

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

VTVS3V3ASMF-M3-08 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VTVS3V3ASMF-M3-08 is a rectangular pad with dimensions of 1.3 mm x 0.8 mm, with a 0.5 mm x 0.5 mm thermal pad in the center.
  • Yes, the VTVS3V3ASMF-M3-08 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the PCB pads. Use a reflow oven or a hot air gun to solder the component, following the recommended soldering profile.
  • Yes, the VTVS3V3ASMF-M3-08 is compatible with lead-free soldering processes, such as SAC305 or Sn96.5Ag3Cu0.5. However, the soldering profile may need to be adjusted to accommodate the higher melting point of lead-free solders.
  • The typical power dissipation of the VTVS3V3ASMF-M3-08 is around 1.5 W, but this can vary depending on the specific application and operating conditions. It's essential to ensure that the device is properly heat-sinked to prevent overheating.

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VTVS3V3ASMF-M3-08 Overview

Use the download button to access the VTVS3V3ASMF-M3-08 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like VTVS3, or try a keyword search, such as Transient Suppressors

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