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VX78039-500 - CUI Inc.

Description: Non-Isolated DC/DC Converters 12-36Vin 9Vout 0.5A 4.5W SIP non-Iso

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PCB Footprints
VX78039-500 - CUI Inc. PCB footprint - Other - Other - VX78039-500-1
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3D Models
VX78039-500 - CUI Inc.  - 3D model - Other - VX78039-500-1
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VX78039-500 Details

  • Manufacturer Part Number:

    VX78039-500

  • Brand Name:

    CUI Inc

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SIP-3

  • ECCN Code:

    EAR99

  • Manufacturer:

    CUI Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    CIS, EN, IEC, UL

  • Efficiency (Main Output):

    93%

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    12 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PSIP-T3

  • Length:

    11.6 mm

  • Line Regulation-Max:

    0.4%

  • Load Regulation-Max:

    0.6%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    9.27 V

  • Output Voltage-Min:

    8.73 V

  • Output Voltage-Nom:

    9 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP3,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.0265125 Vrms

  • Seated Height-Max:

    10.41 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    4.5 W

  • Trim/Adjustable Output:

    NO

  • Width:

    7.55 mm

VX78039-500 Frequently Asked Questions (FAQs)

  • CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1-2 W/m-K should be used between the module and the heat sink.
  • To ensure reliable start-up and shutdown, CUI recommends a soft-start circuit to limit inrush current and a shutdown circuit to prevent voltage spikes. Additionally, a minimum of 10ms delay between power-on and enable signals is recommended.
  • The maximum allowable capacitance on the output is 100uF. Exceeding this value may cause instability or oscillation in the module.
  • Yes, the VX78039-500 is designed to meet the requirements of IEC 60068-2-6 for vibration. However, it's recommended to follow proper mounting and screw torque procedures to ensure reliable operation.
  • CUI recommends using the module's built-in fault monitoring pins to detect and troubleshoot issues. The fault pins can be connected to a microcontroller or other monitoring circuitry to detect and respond to faults.

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VX78039-500 Overview

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