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VX7815-500 - CUI Inc.

Description: Non-Isolated DC/DC Converters 19-36Vin 15Vout 0.5A 7.5W SIP non-Iso

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PCB Footprints
VX7815-500 - CUI Inc. PCB footprint - Other - Other - VX7815-500-2
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3D Models
VX7815-500 - CUI Inc.  - 3D model - Other - VX7815-500-2
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VX7815-500 Details

  • Manufacturer Part Number:

    VX7815-500

  • Brand Name:

    CUI Inc

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SIP-3

  • ECCN Code:

    EAR99

  • Manufacturer:

    CUI Inc

  • YTEOL:

    3

  • Additional Feature:

    IT ALSO HAS -15V OUTPUT

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    CIS, EN, IEC, UL

  • Efficiency (Main Output):

    95%

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    19 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PSIP-T3

  • Length:

    11.6 mm

  • Line Regulation-Max:

    0.4%

  • Load Regulation-Max:

    0.6%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    15.45 V

  • Output Voltage-Min:

    14.55 V

  • Output Voltage-Nom:

    15 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP3,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.03535 Vrms

  • Seated Height-Max:

    10.41 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    7.5 W

  • Trim/Adjustable Output:

    NO

  • Width:

    7.55 mm

VX7815-500 Frequently Asked Questions (FAQs)

  • CUI Inc recommends a 4-layer PCB with a solid ground plane, and thermal vias under the module to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a heat sink or thermal interface material can be used to improve thermal performance.
  • To ensure EMC, CUI Inc recommends following proper PCB layout and design guidelines, using a metal enclosure, and adding EMI filters or shielding if necessary. Additionally, the module should be placed at least 10 mm away from other components to minimize electromagnetic interference.
  • The maximum allowable capacitance for the output filter capacitor is 1000 μF. Exceeding this value may cause instability or oscillation in the converter.
  • Yes, the VX7815-500 is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and screw torque guidelines to ensure the module remains securely attached to the PCB.
  • CUI Inc recommends using a fuse with a rating of 5 A to 10 A, and a type that is suitable for high-inrush current applications, such as a slow-blow or time-delay fuse.

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VX7815-500 Overview

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