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W02MG - Multicomp Pro

Description: BRIDGE RECTIFIER, 200V, 1.5A, WOB

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PCB Footprints
W02MG - Multicomp Pro PCB footprint - Other - Other - W02MG-1
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3D Models
W02MG - Multicomp Pro  - 3D model - Other - W02MG-1
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W02MG Details

  • Manufacturer Part Number:

    W02MG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    6.1

  • Breakdown Voltage-Min:

    200 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    O-PBCY-W4

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

W02MG Frequently Asked Questions (FAQs)

  • The recommended storage condition for W02MG is in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 60%. This helps prevent moisture absorption and ensures the component's reliability.
  • While W02MG is suitable for general-purpose applications, it's not recommended for high-frequency applications above 100 kHz due to its internal construction and material limitations. For high-frequency applications, consider using specialized components designed for such purposes.
  • To prevent damage during soldering, use a soldering iron with a temperature below 260°C and avoid applying excessive force or pressure to the component. Also, ensure the soldering time is within the recommended 3-5 seconds to prevent overheating.
  • Yes, W02MG is compatible with lead-free soldering processes. However, it's essential to follow the recommended soldering profile and temperature to ensure reliable joints and prevent component damage.
  • The typical failure mode of W02MG is due to overheating, which can cause the component to open or short circuit. This can be prevented by ensuring proper thermal management, using adequate heat sinks, and avoiding excessive voltage or current stress.

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W02MG Overview

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