GeneSic recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3mm to 0.5mm is recommended.
Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a heat sink or thermal interface material. Also, follow the recommended operating conditions and derating guidelines.
GeneSic recommends a gate drive circuit with a low impedance output stage, a voltage swing of 10-15V, and a current capability of at least 1A. A gate resistor of 10-20 ohms is also recommended.
Use a TVS diode or a zener diode for overvoltage protection, and consider adding a current sense resistor and a fuse or a current limiter for overcurrent protection.
Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the leads or die. Use an anti-static wrist strap or mat when handling the devices.
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