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W25M512JVBIQ - Winbond

Description: Winbond Electronics IC FLASH 512MBIT SPI 24TFBGA

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Symbol

W25M512JVBIQ - Winbond - PCB symbol

PCB Footprints

W25M512JVBIQ - Winbond PCB footprint - BGA - BGA - TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays)

3D Models

W25M512JVBIQ - Winbond - 3D model - BGA - TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays)

Datasheet Download Datasheet
Stock & Prices Price & Stock for W25M512JVBIQ
Part Number W25M512JVBIQ
Manufacturer Winbond
Pin Count 24
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays)
Released Date Mar 6, 2025
Last Modified Date Mar 6, 2025 3:21 AM UTC
Pinout / Pin List Click Here (Member Only)

W25M512JVBIQ Details

Manufacturer Part Number:
W25M512JVBIQ
Manufacturer:
Winbond Electronics Corp

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W25M512JVBIQ Overview

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