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W25M512JWFIQ - Winbond

Description:  New Family of SpiFlash® Memories – W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte) – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – 3 or 4-Byte Addressing Mode – Software Die Select (C2h) – Software & Hardware Reset(1)  High Performance Serial Flash – 104MHz Standard/Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 52MB/s continuous data transfer rate – More than 100,000 Program/Erase cycles – More than 20-year data retention 

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W25M512JWFIQ - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin SOIC 300-mil (Package Code F)
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3D Models
W25M512JWFIQ - Winbond  - 3D model - Small Outline Packages - 16-Pin SOIC 300-mil (Package Code F)
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W25M512JWFIQ Details

  • Manufacturer Part Number:

    W25M512JWFIQ

  • Manufacturer:

    Winbond Electronics Corp

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