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W25Q01NWTBIQ - Winbond

Description: 1Gb Serial NOR Flash 133MHz TFBGA (5X5)24

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PCB Footprints
W25Q01NWTBIQ - Winbond PCB footprint - BGA - BGA - TFBGA (5X5) - 24-1
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3D Models
W25Q01NWTBIQ - Winbond  - 3D model - BGA - TFBGA (5X5) - 24-1
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W25Q01NWTBIQ Details

  • Manufacturer Part Number:

    W25Q01NWTBIQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • Memory IC Type:

    FLASH

W25Q01NWTBIQ Frequently Asked Questions (FAQs)

  • The W25Q01NWTBIQ has a minimum of 100,000 erase cycles per sector, and a total of 1,000,000 erase cycles for the entire device.
  • The hold pin (HOLD#) should be pulled high during power-up and power-down to prevent the device from entering a state where it may not respond to commands. It's recommended to connect a pull-up resistor to VCC and a capacitor to GND to ensure a clean power-up and power-down sequence.
  • The W25Q01NWTBIQ supports clock frequencies up to 104 MHz, but it's recommended to use a clock frequency of 40 MHz or lower to ensure reliable operation and minimize power consumption.
  • The WP# pin should be connected to VCC to enable write protection. When WP# is low, the device is in write-protect mode, and any write or erase operations will be ignored. It's recommended to use a pull-up resistor to VCC to ensure the device is in write-protect mode by default.
  • The Deep Power-Down (DP) mode is a low-power state that reduces the device's power consumption to a minimum. It's useful for battery-powered devices or applications where power consumption needs to be minimized. In DP mode, the device is not accessible, and all internal operations are halted.

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