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W63AH6NBVADI - Winbond

Description: This is a 1Gb Low Power DDR3 SDRAM organized as 8M words x 8 banks x 16bits

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PCB Footprints
W63AH6NBVADI - Winbond PCB footprint - BGA - BGA - VFBGA 178 Ball
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3D Models
W63AH6NBVADI - Winbond  - 3D model - BGA - VFBGA 178 Ball
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W63AH6NBVADI Details

  • Manufacturer Part Number:

    W63AH6NBVADI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-178

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.32

  • Date Of Intro:

    2019-05-30

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX

  • Clock Frequency-Max (fCLK):

    1066 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    8

  • JESD-30 Code:

    R-PBGA-B178

  • Length:

    11.5 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    LPDDR3 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    178

  • Number of Words:

    67108864 words

  • Number of Words Code:

    64000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA178,13X17,32/25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    8

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.039 mA

  • Supply Voltage-Max (Vsup):

    1.3 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    11 mm

W63AH6NBVADI Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves keeping the signal traces short and direct, using a solid ground plane, and placing decoupling capacitors close to the chip. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • The W63AH6NBVADI requires a specific power-up and power-down sequencing to ensure proper operation. The recommended sequence is to power up the VCCIO and VCCQ pins first, followed by the VREF pin, and then the clock signal. During power-down, the sequence should be reversed.
  • The W63AH6NBVADI has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate thermal management, such as using a heat sink or thermal pad, and ensuring good airflow around the device.
  • To ensure clock signal integrity and reduce jitter, it's recommended to use a high-quality clock source, such as a crystal oscillator, and to use a clock buffer or repeater to regenerate the clock signal. Additionally, the PCB layout should be designed to minimize clock signal routing and to use a dedicated clock trace.
  • The W63AH6NBVADI has built-in ESD protection, but it's still essential to handle the device with care to prevent damage. Precautions include using an anti-static wrist strap or mat, handling the device by the package body, and avoiding touching the pins or leads.

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W63AH6NBVADI Overview

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