W968D6DAGX7I - Winbond

W968D6DAGX7I Details

• Manufacturer Part Number:

  W968D6DAGX7I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  VFBGA-54

• Country Of Origin:

  Taiwan

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  3

• Access Time-Max:

  70 ns

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PBGA-B54

• Length:

  8 mm

• Memory Density:

  268435456 bit

• Memory IC Type:

  PSEUDO STATIC RAM

• Memory Width:

  16

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  54

• Number of Words:

  16777216 words

• Number of Words Code:

  16000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  16MX16

• Output Characteristics:

  3-STATE

• Output Enable:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA54,6X9,30

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Parallel/Serial:

  PARALLEL

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1 mm

• Standby Current-Max:

  0.0004 A

• Standby Voltage-Min:

  1.7 V

• Supply Current-Max:

  0.04 mA

• Supply Voltage-Max (Vsup):

  1.95 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.75 mm

• Terminal Position:

  BOTTOM

• Width:

  6 mm