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WBZ450UE-I - Microchip

Description: RF System on a Chip - SoC Bluetooth Low Energy/802.15.4 Combo Module with u.FL Antenna

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PCB Footprints
WBZ450UE-I - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-Pin VQFN(height 1mm)
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3D Models
WBZ450UE-I - Microchip  - 3D model - Quad Flat No-Lead - 32-Pin VQFN(height 1mm)
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WBZ450UE-I Details

  • Manufacturer Part Number:

    WBZ450UE-I

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODULE-30

  • Pin Count:

    30

  • Manufacturer Package Code:

    MODULE-30

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • JESD-30 Code:

    R-XXMA-N30

  • Length:

    18.7 mm

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Packing Method:

    TRAY

  • Seated Height-Max:

    3 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.9 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    UNSPECIFIED

  • Width:

    13.4 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

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WBZ450UE-I Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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