WFMB2010R2000FEA - Vishay

WFMB2010R2000FEA Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and land pattern for WFMB2010R2000FEA?
  Vishay provides a recommended PCB layout and land pattern in their application note AN42171, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal performance and reliability.
• How do I handle the thermal interface material (TIM) for WFMB2010R2000FEA?
  Vishay recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. The TIM should be applied evenly and thinly (typically 0.05 mm to 0.10 mm) to the base plate of the device. Vishay also provides a list of recommended TIMs in their application note AN42171.
• What is the maximum allowable voltage derating for WFMB2010R2000FEA?
  Vishay recommends derating the maximum voltage by 10% to 15% to ensure reliable operation and to account for voltage spikes or transients. This means that for a 2000 V device, the maximum allowable voltage would be around 1700 V to 1800 V.
• How do I ensure the reliability of WFMB2010R2000FEA in high-humidity environments?
  Vishay recommends following the guidelines outlined in their application note AN42171 for humidity protection. This includes applying a conformal coating, using a moisture-resistant packaging, and ensuring proper storage and handling procedures.
• What is the recommended soldering profile for WFMB2010R2000FEA?
  Vishay recommends following the soldering profile outlined in their application note AN42171, which includes a peak temperature of 260°C to 270°C, a dwell time of 10 seconds to 30 seconds, and a cooling rate of 4°C/s to 6°C/s.