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WPN252010H1R0MT - SUNLORD

Description: 1 µH Shielded Drum Core, Wire wound Inductor 2.5 A 76mOhm Max 1008 (2520 Metric)

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PCB Footprints
WPN252010H1R0MT - SUNLORD PCB footprint - Other - Other - WPN252010H1R0MT-1
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3D Models
WPN252010H1R0MT - SUNLORD  - 3D model - Other - WPN252010H1R0MT-1
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WPN252010H1R0MT Details

  • Manufacturer Part Number:

    WPN252010H1R0MT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Sunlord

  • YTEOL:

    7.8

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    Ferrite

  • DC Resistance:

    0.076 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Current-Max:

    2.5 A

  • Self Resonance Frequency:

    46 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

WPN252010H1R0MT Frequently Asked Questions (FAQs)

  • The recommended land pattern for WPN252010H1R0MT is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape and a solder mask opening of 2.2mm x 1.0mm.
  • Yes, WPN252010H1R0MT is suitable for high-frequency applications up to 6 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, it's essential to consider the component's parasitic inductance and capacitance in the circuit design.
  • WPN252010H1R0MT is rated for operation up to 150°C, with a derating of 1.25% per °C above 125°C. It's essential to consider the component's temperature coefficient and thermal resistance in the design to ensure reliable operation in high-temperature environments.
  • Yes, WPN252010H1R0MT is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature to ensure reliable joint formation.
  • The typical tolerance for the capacitance value of WPN252010H1R0MT is ±10% or ±20%, depending on the specific part number and capacitance value. It's essential to check the datasheet or consult with the manufacturer for specific tolerance information.

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WPN252010H1R0MT Overview

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