The recommended land pattern for WSL0805R0800FEK is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
Yes, WSL0805R0800FEK is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and to follow the recommended storage and handling procedures.
To prevent damage, handle WSL0805R0800FEK by the edges, avoiding touching the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Also, ensure that the component is not subjected to excessive mechanical stress, such as bending or flexing.
The recommended soldering profile for WSL0805R0800FEK is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the component and to ensure reliable solder joints.
WSL0805R0800FEK is rated for operation in a humid environment, but it's essential to follow the recommended storage and handling procedures to prevent moisture absorption. If the component is exposed to high humidity or moisture, it may be necessary to bake the component before assembly to remove any absorbed moisture.
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WSL0805R0800FEK Overview
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