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WSL1206R1300FEB - Vishay

Description: RES 0.13 OHM 1% 1/4W 1206

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PCB Footprints
WSL1206R1300FEB - Vishay PCB footprint - Resistor Chip - Resistor Chip - WSL1206 *
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3D Models
WSL1206R1300FEB - Vishay  - 3D model - Resistor Chip - WSL1206 *
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WSL1206R1300FEB Details

  • Manufacturer Part Number:

    WSL1206R1300FEB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Israel, Mexico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Height:

    0.635 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.13 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    75 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1803 V

WSL1206R1300FEB Frequently Asked Questions (FAQs)

  • The recommended land pattern for WSL1206R1300FEB is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, WSL1206R1300FEB is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and to follow the recommended storage and handling procedures.
  • To prevent damage, handle WSL1206R1300FEB by the edges, avoiding touching the component's surface or leads. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Also, ensure that the component is properly seated and aligned during assembly to prevent mechanical stress.
  • The recommended soldering profile for WSL1206R1300FEB is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the component and to ensure reliable solder joints.
  • WSL1206R1300FEB is not designed for use in humid or corrosive environments. It's essential to ensure that the component is used in a controlled environment, with a relative humidity of 60% or less, and to follow proper cleaning and drying procedures to prevent corrosion.

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WSL1206R1300FEB Overview

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