WSL1206R2500FEB footprint, schematic symbol and 3D model by Vishay

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WSL1206R2500FEB Details

The recommended land pattern for WSL1206R2500FEB is a rectangular pad with a size of 1.3 mm x 1.3 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
WSL1206R2500FEB is rated for operation up to 150°C, but it's recommended to derate the power rating at higher temperatures. Consult the datasheet for derating curves and consult with a thermal expert if necessary.
WSL1206R2500FEB is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the component pins, and use ESD-protected workstations and tools.
The recommended soldering profile for WSL1206R2500FEB is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. Consult the datasheet for more details.
WSL1206R2500FEB is not hermetically sealed, so it's not recommended for use in humid environments. If you must use it in a humid environment, consider applying a conformal coating to protect the device.

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