The recommended land pattern for WSL2010R0800FEA is a rectangular pad with a size of 1.5 mm x 3.5 mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure a good thermal connection to a heat sink or a thermal pad, and consider using thermal interface materials (TIMs) to reduce thermal resistance. A thermal resistance of 10°C/W or lower is recommended.
The maximum operating temperature range for WSL2010R0800FEA is -55°C to 150°C, with a storage temperature range of -55°C to 180°C.
To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid mechanical stress, electrical overstress, and thermal shock. Also, consider using a conformal coating to protect the device from environmental factors.
The WSL2010R0800FEA has an ESD rating of 2 kV human body model (HBM) and 250 V machine model (MM). To prevent ESD damage, handle the device with ESD-protective equipment, and use ESD-protective packaging and storage materials.
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WSL2010R0800FEA Overview
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