The recommended land pattern for WSL2010R2500FEA is a rectangular pad with a size of 1.5 mm x 3.5 mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal interface material (TIM) and a heat sink if necessary. Also, ensure good airflow around the device.
The maximum operating temperature range for WSL2010R2500FEA is -55°C to 150°C, with a storage temperature range of -55°C to 180°C.
To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid mechanical stress, electrical overstress, and thermal shock.
The WSL2010R2500FEA has an ESD rating of Human Body Model (HBM) of ±2 kV and Charged Device Model (CDM) of ±500 V. Handle the device with ESD-protective equipment and follow proper ESD handling procedures.
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WSL2010R2500FEA Overview
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