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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSLF2512L5000FEB
- Part Number WSLF2512L5000FEB
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLF2512L5000FEB Details
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Manufacturer Part Number:
WSLF2512L5000FEB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Unknown
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Country Of Origin:
Israel, Mexico, USA
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
WSLF2512L5000FEB Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the WSLF2512L5000FEB is a rectangular pad with a length of 2.5mm, a width of 1.25mm, and a thickness of 0.5mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
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The WSLF2512L5000FEB has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate thermal relief by using a thermal pad or a heat sink, and ensuring good airflow around the component.
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The recommended soldering profile for the WSLF2512L5000FEB is a reflow soldering process with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/second.
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Yes, the WSLF2512L5000FEB is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent mechanical stress.
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To ensure magnetic shielding, it's recommended to use a shielded inductor or to add a magnetic shield around the inductor. Additionally, keeping the inductor away from other magnetic components and using a ground plane on the PCB can help minimize electromagnetic interference (EMI).
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WSLF2512L5000FEB Overview
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