The recommended land pattern for WSLP0603R0400FEA is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should also have a solderable finish, such as tin or silver, to ensure good solder joint reliability.
Yes, WSLP0603R0400FEA is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated for temperature to prevent overheating and ensure reliable operation.
Yes, WSLP0603R0400FEA is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. The component's terminations are made of a lead-free, tin-silver-copper alloy that is compatible with most lead-free soldering processes.
The typical power rating of WSLP0603R0400FEA is 0.25 W, based on a maximum operating temperature of 70°C and a maximum current of 50 mA. However, the actual power rating may vary depending on the specific application and operating conditions.
Yes, WSLP0603R0400FEA is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, meeting the requirements for lead-free and halogen-free materials.
Trust Checks
This model has been verified by system checks.
System Verified
Sponsored
WSLP0603R0400FEA Overview
Use the download button to access the WSLP0603R0400FEA schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like WSLP0,
or try a keyword search, such as Metal Strip Resistor
