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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSLP0603R0500FEB
- Part Number WSLP0603R0500FEB
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0603R0500FEB Details
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Manufacturer Part Number:
WSLP0603R0500FEB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Unknown
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
12
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Additional Feature:
ANTI-SULFUR
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Construction:
Rectangular
WSLP0603R0500FEB Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0603R0500FEB is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape.
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To handle thermal considerations, ensure good thermal conduction by using a thermal via or a thermal pad under the component. Also, consider using a thermal interface material (TIM) to improve heat transfer.
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The maximum operating temperature range for WSLP0603R0500FEB is -55°C to +150°C, with a derating of 1.33% per °C above 25°C.
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To ensure reliability, follow proper storage and handling procedures, use a clean and dry assembly process, and perform thorough inspection and testing to detect any defects or anomalies.
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The ESD protection requirements for WSLP0603R0500FEB are Human Body Model (HBM) Class 2, Machine Model (MM) Class B, and Charged Device Model (CDM) Class C.
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WSLP0603R0500FEB Overview
Use the download button to access the WSLP0603R0500FEB 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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