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- Stock & Prices $ Price & Stock for WSLP0603R0600FEA
- Part Number WSLP0603R0600FEA
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0603R0600FEA Details
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Manufacturer Part Number:
WSLP0603R0600FEA
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
12
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Additional Feature:
ANTI-SULFUR
WSLP0603R0600FEA Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0603R0600FEA is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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While WSLP0603R0600FEA is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at the operating temperature. Additionally, the PCB material and soldering process should be suitable for high-temperature applications.
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To prevent ESD damage, handle WSLP0603R0600FEA with ESD-safe materials, such as wrist straps, mats, and bags. Ensure that the PCB assembly process includes ESD protection measures, and consider adding ESD protection devices in the circuit design.
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The recommended soldering process for WSLP0603R0600FEA is a reflow soldering process with a peak temperature of 260°C and a dwell time of 20-30 seconds. Ensure that the soldering process is optimized for the specific PCB material and component layout.
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While WSLP0603R0600FEA is not hermetically sealed, it is designed to operate in a normal environment with a relative humidity of up to 60%. However, if the component will be exposed to high humidity or moisture, consider adding conformal coating or potting to protect the device.
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WSLP0603R0600FEA Overview
Use the download button to access the WSLP0603R0600FEA 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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