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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSLP0805R0300FEB
- Part Number WSLP0805R0300FEB
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0805R0300FEB Details
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Manufacturer Part Number:
WSLP0805R0300FEB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
11
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Additional Feature:
ANTI-SULFUR
WSLP0805R0300FEB Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0805R0300FEB is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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WSLP0805R0300FEB is rated for operation up to 150°C, but it's recommended to derate the power rating at higher temperatures. Consult the datasheet for derating curves and consult with a thermal expert if you're unsure.
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WSLP0805R0300FEB is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps and mats, and avoid touching the component pins. Follow proper ESD handling procedures to prevent damage.
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WSLP0805R0300FEB is not hermetically sealed, so it's not recommended for use in humid environments. If you must use it in a humid environment, consider applying a conformal coating to protect the device.
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The recommended soldering profile for WSLP0805R0300FEB is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Consult the datasheet for more detailed soldering profile recommendations.
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WSLP0805R0300FEB Overview
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