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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSLP0805R0430FEB
- Part Number WSLP0805R0430FEB
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0805R0430FEB Details
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Manufacturer Part Number:
WSLP0805R0430FEB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
6 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
11
WSLP0805R0430FEB Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0805R0430FEB is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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While WSLP0805R0430FEB has a high operating temperature range of -55°C to +150°C, it's not recommended for use in extremely high-temperature applications (>125°C) without proper derating. Consult the datasheet and application notes for specific guidance.
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WSLP0805R0430FEB is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the component pins, and use anti-static packaging during storage and transportation.
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The recommended soldering profile for WSLP0805R0430FEB is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Avoid exceeding 280°C, as this can cause damage to the component.
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WSLP0805R0430FEB is a moisture-sensitive device. While it can operate in humid environments, it's essential to follow proper handling and storage procedures to prevent moisture absorption. Use a dry box or desiccant packaging during storage, and bake the component before reflow soldering if it has been exposed to high humidity.
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WSLP0805R0430FEB Overview
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