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WSLP1206R0120FEA18 - Vishay

Description: WSLP1206R0120FEA18

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WSLP1206R0120FEA18 - Vishay - PCB symbol
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PCB Footprints
WSLP1206R0120FEA18 - Vishay PCB footprint - Resistor Chip - Resistor Chip - WSL12065L000FEA18-+-
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WSLP1206R0120FEA18 - Vishay - 3D model - Resistor Chip - WSL12065L000FEA18-+-
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WSLP1206R0120FEA18 Details

  • Manufacturer Part Number:

    WSLP1206R0120FEA18

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Israel, Mexico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Height:

    0.635 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Resistance:

    0.012 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    75 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1549 V

WSLP1206R0120FEA18 Frequently Asked Questions (FAQs)

  • The recommended land pattern for WSLP1206R0120FEA18 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • WSLP1206R0120FEA18 is rated for operation up to 150°C, but it's recommended to derate the power rating at higher temperatures. Consult the datasheet for derating curves and consult with a Vishay application engineer for specific guidance.
  • WSLP1206R0120FEA18 is an ESD-sensitive device. Handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the component pins or body, and ensure that the assembly process is ESD-controlled.
  • The recommended soldering profile for WSLP1206R0120FEA18 is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. Consult the datasheet for more detailed guidance.
  • WSLP1206R0120FEA18 is not hermetically sealed and is sensitive to moisture. It's recommended to use conformal coating or potting to protect the component in humid or wet environments. Consult with a Vishay application engineer for specific guidance.

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WSLP1206R0120FEA18 Overview

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