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WSLP2512R0100FEA - Vishay

Description: 10 mOhms ±1% 3W Chip Resistor 2512 (6332 Metric) Anti-Sulfur, Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding Metal Element

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WSLP2512R0100FEA - Vishay - PCB symbol
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PCB Footprints
WSLP2512R0100FEA - Vishay PCB footprint - Resistor Chip - Resistor Chip - WSL2512
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WSLP2512R0100FEA - Vishay - 3D model - Resistor Chip - WSL2512
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WSLP2512R0100FEA Details

  • Manufacturer Part Number:

    WSLP2512R0100FEA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Israel, Mexico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Height:

    0.635 mm

  • Package Length:

    6.35 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.18 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Power Dissipation (P):

    3 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.01 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    75 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1732 V

WSLP2512R0100FEA Frequently Asked Questions (FAQs)

  • The recommended land pattern for WSLP2512R0100FEA is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a thermal interface material (TIM) between the resistor and the PCB. Also, ensure good airflow around the component.
  • The recommended soldering profile for WSLP2512R0100FEA is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, WSLP2512R0100FEA is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the parasitic inductance and capacitance of the component and the PCB layout to minimize signal degradation.
  • To ensure reliability in a humid environment, apply a conformal coating to the PCB, and consider using a moisture-resistant coating on the resistor. Also, ensure good PCB cleanliness and storage conditions to prevent moisture absorption.

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WSLP2512R0100FEA Overview

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