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XA7A100T-1FGG484Q - AMD

Description: Artix-7 XA Field Programmable Gate Array (FPGA) IC 285 4976640 101440 484-BBGA

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XA7A100T-1FGG484Q - AMD PCB footprint - BGA - BGA - FGG484
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XA7A100T-1FGG484Q - AMD  - 3D model - BGA - FGG484
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XA7A100T-1FGG484Q Details

  • Manufacturer Part Number:

    XA7A100T-1FGG484Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    9

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7925

  • Number of Inputs:

    285

  • Number of Logic Cells:

    101440

  • Number of Outputs:

    285

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7925 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    HKMG, 28 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XA7A100T-1FGG484Q Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and reference designs for the XA7A100T-1FGG484Q. It's recommended to follow the guidelines for layer stackup, signal routing, and decoupling to ensure optimal signal integrity and minimize electromagnetic interference (EMI).
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization. Implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and use the FPGA's built-in power management features. For thermal management, ensure proper airflow, use thermal interfaces, and consider heat sinks or fans if necessary.
  • Implement secure boot mechanisms, such as encrypted bitstreams and secure authentication, to prevent tampering. Use the FPGA's built-in security features, like the AES decryption engine, and follow AMD's guidelines for secure FPGA design and implementation.
  • Use the FPGA's high-speed interfaces (e.g., PCIe, DDR4) and implement data transfer protocols like AXI4 or AXI4-Lite. Ensure proper signal integrity, use data buffering and caching, and consider using DMA controllers to optimize data transfer.
  • Use AMD's Vivado Design Suite, which provides a comprehensive design environment for FPGA development. Follow the recommended design flow: RTL design, synthesis, implementation, and verification. Utilize IP integrator and IP packs for IP core development and verification.

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XA7A100T-1FGG484Q Overview

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Image Part Number Model
Part Image XA7A100T-1FGG484I AMD

Field Programmable Gate Array, 7925 CLBs, 1098MHz, 101440-Cell, HKMG, PBGA484

Part Image XA7A100T-1FGG484Q AMD Xilinx

Field Programmable Gate Array, 7925 CLBs, 1098MHz, 101440-Cell, HKMG, PBGA484

Part Image XA7A100T-1FGG484I AMD Xilinx

Field Programmable Gate Array, 7925 CLBs, 1098MHz, 101440-Cell, HKMG, PBGA484