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XAZU2EG-1SBVA484Q - AMD

Description: IC SOC CORTEX-A53 484FCBGA

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PCB Footprints
XAZU2EG-1SBVA484Q - AMD PCB footprint - BGA - BGA - 484-PIB BGA
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3D Models
XAZU2EG-1SBVA484Q - AMD  - 3D model - BGA - 484-PIB BGA
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XAZU2EG-1SBVA484Q Details

  • Manufacturer Part Number:

    XAZU2EG-1SBVA484Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-484

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.61 mm

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    PROGRAMMABLE SoC

XAZU2EG-1SBVA484Q Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XAZU2EG-1SBVA484Q is -40°C to 100°C, as specified in the datasheet. However, it's recommended to operate within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • To optimize power consumption, ensure that the device is operated within the recommended voltage range (1.0V to 1.2V) and that the clock frequency is set to the lowest required value. Additionally, use power-saving features like clock gating, dynamic voltage and frequency scaling, and shutdown modes when possible.
  • For optimal performance and signal integrity, follow the recommended PCB layout guidelines in the datasheet, including using a 4-layer PCB, placing decoupling capacitors close to the device, and minimizing signal trace lengths and impedance mismatches.
  • To troubleshoot clock skew or signal integrity issues, use tools like oscilloscopes, logic analyzers, or signal integrity analysis software to identify the root cause. Check the PCB layout, signal routing, and termination schemes, and ensure that the device is operated within the recommended specifications.
  • Handle the device with care to prevent electrostatic discharge (ESD) damage. Store the device in its original packaging or an ESD-protective container, and avoid exposing it to extreme temperatures, humidity, or physical stress.

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XAZU2EG-1SBVA484Q Overview

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