XC6SLX9-3CSG225C - AMD

XC6SLX9-3CSG225C Details

• Manufacturer Part Number:

  XC6SLX9-3CSG225C

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  AMD

• YTEOL:

  4

• Clock Frequency-Max:

  862 MHz

• Combinatorial Delay of a CLB-Max:

  0.21 ns

• JESD-30 Code:

  S-PBGA-B225

• JESD-609 Code:

  e1

• Length:

  13 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  715

• Number of Inputs:

  160

• Number of Logic Cells:

  9152

• Number of Outputs:

  160

• Number of Terminals:

  225

• Operating Temperature-Max:

  85 °C

• Organization:

  715 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA225,15X15,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.4 mm

• Supply Voltage-Max:

  1.26 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS, 40 nm

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  13 mm