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XC7SET08GV,125 - Nexperia

Description: 2-input AND gate

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PCB Footprints
XC7SET08GV,125 - Nexperia PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT753
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3D Models
XC7SET08GV,125 - Nexperia  - 3D model - SOT23 (5-Pin) - SOT753
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XC7SET08GV,125 Details

  • Manufacturer Part Number:

    XC7SET08GV,125

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP

  • Package Description:

    SC-74, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT753

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.45

  • Family:

    AHCT/VHCT/VT

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Logic IC Type:

    AND GATE

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    10.5 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

XC7SET08GV,125 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for XC7SET08GV,125 is a QFN32 package with a 5x5mm body size and 0.5mm pitch. The datasheet provides a recommended land pattern, but it's essential to consult the Nexperia application note AN11173 for detailed PCB design guidelines.
  • To ensure reliable operation in high-temperature environments, it's crucial to follow proper thermal management practices. This includes providing adequate heat dissipation, using thermal vias, and ensuring a low thermal resistance between the device and the PCB. Additionally, consult the datasheet for the device's operating temperature range and thermal characteristics.
  • The XC7SET08GV,125 has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. The device can withstand ESD pulses up to 2 kV according to the Human Body Model (HBM) and 150 V according to the Machine Model (MM). Consult the datasheet for more information on ESD protection and handling guidelines.
  • While the XC7SET08GV,125 is not specifically designed for automotive applications, it can be used in certain automotive systems. However, it's essential to ensure that the device meets the required automotive standards, such as AEC-Q100, and that it's properly qualified and validated for the specific application. Consult with Nexperia's automotive support team for more information.
  • To troubleshoot XC7SET08GV,125-related issues, start by consulting the datasheet and application notes. Check for proper power supply, clock signal integrity, and signal routing. Use oscilloscopes and logic analyzers to debug the device's behavior. If the issue persists, contact Nexperia's technical support team for further assistance.

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XC7SET08GV,125 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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