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XC7WH14DC,125 - Nexperia

Description: Triple inverting Schmitt trigger

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PCB Footprints
XC7WH14DC,125 - Nexperia PCB footprint - Small Outline Packages - Small Outline Packages - SOT765-1
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3D Models
XC7WH14DC,125 - Nexperia  - 3D model - Small Outline Packages - SOT765-1
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XC7WH14DC,125 Details

  • Manufacturer Part Number:

    XC7WH14DC,125

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT765-1

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.6

  • Family:

    LV/LV-A/LVX/H

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.3 mm

  • Logic IC Type:

    INVERTER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    3

  • Number of Inputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    20.5 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

XC7WH14DC,125 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for XC7WH14DC,125 is a QFN16 package with a 3x3 mm body size and 0.5 mm pitch. A recommended land pattern is available in the Nexperia package outline drawing.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using thermal vias, thermal pads, and a heat sink if necessary. The device has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB.
  • The maximum operating temperature range for XC7WH14DC,125 is -40°C to +125°C. However, the device can be stored at temperatures between -55°C and +150°C.
  • To ensure EMC, follow proper PCB design and layout guidelines, such as keeping sensitive analog traces away from digital traces, using shielding, and implementing proper grounding and decoupling techniques.
  • The recommended soldering conditions for XC7WH14DC,125 are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that meets the IPC J-STD-020D standard.

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XC7WH14DC,125 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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