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XC7Z014S-2CLG484E - AMD

Description: SoC FPGA XC7Z014S-2CLG484E

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PCB Footprints
XC7Z014S-2CLG484E - AMD PCB footprint - BGA - BGA - CLG484
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3D Models
XC7Z014S-2CLG484E - AMD  - 3D model - BGA - CLG484
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XC7Z014S-2CLG484E Details

  • Manufacturer Part Number:

    XC7Z014S-2CLG484E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-484

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

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XC7Z014S-2CLG484E Overview

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