XCZU4EG-3FBVB900E - AMD

XCZU4EG-3FBVB900E Details

• Manufacturer Part Number:

  XCZU4EG-3FBVB900E

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-900

• HTS Code:

  8542.31.00.30

• Manufacturer:

  AMD

• YTEOL:

  19

• JESD-30 Code:

  R-PBGA-B900

• JESD-609 Code:

  e1

• Moisture Sensitivity Level:

  4

• Number of Terminals:

  900

• Operating Temperature-Max:

  100 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  245

• Supply Voltage-Max:

  0.927 V

• Supply Voltage-Min:

  0.873 V

• Supply Voltage-Nom:

  0.9 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

• Terminal Form:

  BALL

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• uPs/uCs/Peripheral ICs Type:

  SoC