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XEF232-1024-FB374-I40 - XMOS

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XEF232-1024-FB374-I40 - XMOS - PCB symbol
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PCB Footprints
XEF232-1024-FB374-I40 - XMOS PCB footprint - BGA - BGA - XEF232-1024-FB374-I40
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XEF232-1024-FB374-I40 - XMOS - 3D model - BGA - XEF232-1024-FB374-I40
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XEF232-1024-FB374-I40 Details

  • Manufacturer Part Number:

    XEF232-1024-FB374-I40

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    FBGA-374

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    XMOS Ltd

  • Has ADC:

    NO

  • Additional Feature:

    Speed Grade 2000 MIPS

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    XEF232

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B374

  • Length:

    18 mm

  • Low Power Mode:

    YES

  • Number of I/O Lines:

    176

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    374

  • Number of Timers:

    40

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA374,21X21,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    1048576

  • ROM (words):

    4194304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.36 mm

  • Speed:

    24 MHz

  • Supply Current-Max:

    1400 mA

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    18 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

XEF232-1024-FB374-I40 Frequently Asked Questions (FAQs)

  • XMOS provides a reference design and layout guidelines in their application notes and development kits. It's recommended to follow these guidelines to ensure optimal performance, signal integrity, and thermal management.
  • XMOS provides a boot loader API and documentation in their software development kit (SDK). Engineers can use this API to create a custom boot loader that meets their specific requirements. Additionally, XMOS offers a boot loader development guide that provides step-by-step instructions.
  • The XEF232 is rated for industrial temperature range, which is -40°C to +85°C. However, it's essential to ensure proper thermal management and heat dissipation to maintain reliable operation within this range.
  • While XMOS provides their own development environment, xTIMEcomposer, the XEF232 can be used with third-party IDEs and development environments. However, engineers may need to create their own project templates, configure the toolchain, and write custom code to interface with the XEF232.
  • XMOS provides a USB debugging tool and documentation in their SDK. Engineers can use this tool to debug and troubleshoot USB-related issues. Additionally, XMOS offers a USB implementation guide that provides detailed information on USB protocol, device configuration, and troubleshooting techniques.

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XEF232-1024-FB374-I40 Overview

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